Anti-Static Packaging Materials Market is anticipated to witness steady growth owing to rising demand from electronics industry
The anti-static packaging materials market has seen significant growth in the recent years. Anti-static packaging materials are used to protect electronic components from electrostatic discharge. They prevent damage to electronics and semiconductor devices during manufacturing, shipping and storage. Some key properties of anti-static packaging materials include anti-static, shielding, cushioning and corrosion resistance. With growing electronics and semiconductor industries worldwide, the need for efficient anti-static packaging solutions for transporting delicate components has increased. The global anti-static packaging materials market size is estimated to be valued at US$ 606.6 Mn in 2024 and is expected to exhibit a CAGR of 5.6% over the forecast period of 2023 to 2030. Key Takeaways Key players operating in the anti-static packaging materials market are Daklapack Group, Sharp Packaging Systems, Polyplus Packaging Ltd., Protective Packaging Corporation Inc., Sekisui Chemical...